According to industry sources on August 28, Taiwan Semiconductor Manufacturing (TSMC), which has been mass-producing 3nm process technology for over two years, is advancing toward commercial production of its more advanced 2nm process technology. Previous reports indicated that TSMC's 2nm process began risk production at the Baoshan fab in Hsinchu Science Park last July, a quarter earlier than the market's general expectation of fourth-quarter launch. Regarding large-scale production timing, TSMC Chairman and CEO C.C. Wei has consistently indicated during earnings analyst conference calls over recent quarters that the company is proceeding on schedule to begin mass production in the second half of this year.

In TSMC's previously mass-produced process technologies including 7nm, 5nm, and 3nm, Apple has been a major initial customer, securing substantial production capacity, while other manufacturers gradually obtained more capacity or began receiving allocations later. For TSMC's upcoming 2nm process technology, major customer Apple is expected to secure significant capacity allocation once again.

Recent reports indicate that TSMC's initial 2nm process production customers include Apple, AMD, Broadcom, MediaTek, Intel, and Qualcomm. Among these initial 2nm customers, industry insiders reveal that Apple will receive nearly half of the production capacity, while Qualcomm will be the second-largest customer.