On June 12, ASMPT rose 5.44% in regular trading, trading at 189.8 HKD/share, with turnover of HKD 141 million. The stock continues its rebound momentum following a key order announcement and broader sector tailwinds.

On the news front, ASMPT recently announced it had secured an additional order from a global leading integrated device manufacturer (IDM) for eight thermocompression bonding (TCB) systems to support chip-to-wafer applications for advanced client and data center CPU production. Institutional research estimates that under full production capacity, global HBM production will require 532/648/748 new TCB units in 2026-2028 respectively, positioning ASMPT as a core beneficiary.

The rally is further supported by sector-wide strength, with institutions projecting China mainland CSP capital expenditure has further upside, while AI-driven semiconductor high prosperity is expected to persist through at least late 2027. The stock had previously corrected over 6% following the completion of its NEXX subsidiary divestiture to Applied Materials for USD 120 million on June 3, which narrowed its SEMI segment product portfolio. Today's advance marks a continued recovery from that sell-off.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)