On June 30, ASMPT rose 3.59% in regular trading, trading at HK$229.6/share with turnover of HK$244 million, extending the prior session's strong performance.

On the news front, the company previously announced it has secured a follow-up order from a global leading integrated device manufacturer (IDM) for eight thermocompression bonding (TCB) units to support advanced client and data center CPU production, reflecting the growing adoption of chiplet-based architectures. Meanwhile, advanced packaging equipment procurement has entered an intensive volume phase, as major memory manufacturers accelerate capacity expansion, directly driving upstream equipment demand.

Industry research forecasts the global TCB equipment market will grow from US$760 million to US$1.6 billion by 2028, representing a 28% CAGR. ASMPT has already delivered next-generation equipment to HBM customers, demonstrating competitive advantages in alignment precision, bonding accuracy, and production efficiency. SK Hynix and Samsung Electronics continue aggressively expanding HBM capacity, with ASMPT's TCB equipment adopted by multiple top-tier HBM producers for HBM4 mass production.

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