On June 29, ASMPT rose 4.77% in regular trading, trading at 214.6 HKD/share, with turnover of HKD 185 million. The rally was driven by the company announcing it has secured an additional order from a globally leading integrated device manufacturer (IDM) for eight thermocompression bonding (TCB) units for chip-to-wafer applications supporting advanced client and data center CPU production.

The order reflects growing adoption of chiplet-based architectures. Industry tailwinds remain strong as major memory manufacturers accelerate capacity expansion, directly benefiting upstream equipment suppliers. Research estimates project the global TCB equipment market will grow from USD 760 million to USD 1.6 billion by 2028, representing a 28% compound annual growth rate, fueled by AI compute chip iterations driving HBM demand and heterogeneous integration in logic chips. ASMPT has already delivered next-generation equipment to HBM customers, demonstrating competitive advantages in alignment and bonding precision, production layout efficiency, and throughput capacity.

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