KINGBOARD HLDG (00148) surged nearly 5%, reaching HK$27.86 by the time of writing, with a trading volume of HK$62.02 million. Market forecasts indicate that Nvidia's GB300 AI server racks could see shipments of 55,000 units next year, a 129% year-on-year increase. Notably, the next-generation Vera Rubin 200 platform is expected to begin shipments in Q4 2025.

At the recent GTC conference, Jensen Huang publicly unveiled the Vera Rubin superchip, which integrates a Vera CPU and two large Rubin GPUs. The Kyber architecture in RubinUltra NVL576 will utilize orthogonal backplane technology, replacing copper cables with multilayer PCBs in Switchtray, Midplane, and CX9/CPX connections.

Xiangcai Securities believes that massive capital expenditures from AI and internet giants will drive continuous expansion in computing power clusters. In next-gen server architectures, the replacement of copper cables with PCBs, along with material upgrades, will significantly increase PCB value per server.

KINGBOARD HLDG is a leading PCB supplier in China, with a vertically integrated supply chain covering chemical materials, copper-clad laminates, and PCBs, including single/double/multilayer and HDI products.