LUXSHARE ICT (02475) surged more than 5% in late trading, last changing hands at HK$62.25, up 5.42%, with a trading volume of HK$260 million.

On the news front, on July 23, the company's board secretary responded to investor questions on the interactive platform, confirming that "diamond-copper, as a self-developed project leading the industry, has thermal conductivity superior to ordinary copper, and its thermal expansion coefficient is consistent with silicon, significantly reducing thermal resistance." The response also mentioned that "the R&D team's simulation capabilities are industry-leading, with the difference between measured and simulated results controlled within ±1 degree Celsius." This marks the first official confirmation from LUXSHARE ICT of its foray into diamond-copper materials.

Soochow Securities noted that AI computing power is creating incremental space for diamond heat dissipation. As AI chip power consumption and local heat flux density increase dramatically, traditional copper and aluminum cooling solutions are hitting performance bottlenecks. Diamond has a thermal conductivity five times that of copper and eight times that of aluminum, while its thermal expansion coefficient is close to that of silicon, making it ideal for high-end chip cooling. Diamond-based thermal management solutions are being rolled out from the outside in, through cold plates, lids, chip back surfaces, and substrates. In the short term, diamond-copper and diamond-aluminum composite materials are likely to see scaled production first, while in the medium to long term, CVD thermal interface materials are expected to penetrate high-end computing applications.