On September 4, Intel rose 3.32% in regular trading, trading at $94.8/share, with turnover of $18.93 billion. The rally was driven by reports that TSMC's CoWoS advanced packaging supply contracts are fully booked through next year with virtually no room for further capacity expansion, prompting global tech giants and fabless semiconductor design firms to adopt Intel's improved Embedded Multi-die Interconnect Bridge technology, known as EMIB-T, as an alternative solution.

Adding to the momentum, SK Hynix is reportedly evaluating outsourcing part of its HBM4E base die production to Intel Foundry, a move that could break TSMC's monopoly in this critical segment. The shift is motivated by cost competitiveness and supply chain diversification, as HBM4E base die costs are expected to rise further. Separately, Mizuho lowered its Intel target price from $109 to $92 while maintaining a neutral rating, projecting Intel's advanced packaging revenue could reach $3.5 billion by 2029 driven by EMIB-T adoption on tensor processing units.

The broader Semiconductors sector traded positively, with Micron Technology up 4.31%, Marvell Technology up 4.24%, Advanced Micro Devices up 3.17%, and NVIDIA up 2.58%.

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