On September 18, SICC rose 5.19% in regular trading, trading at HK$68.1/share, with turnover of HK$84.65 million, extending a multi-day rally driven by converging positive catalysts.

On the news front, the company recently disclosed it has been actively positioning around advanced packaging thermal interlayer applications, leveraging silicon carbide's high thermal conductivity and high-temperature resistance to capitalize on heat dissipation demand driven by rising AI computing density. The broader semiconductor sector has strengthened notably, with AI and domestic substitution demand continuing to push the industry upward.

Fundamentally, SICC's management stated at a recent earnings briefing that the SiC substrate industry has transitioned from a phase of rapid price declines to a new stage of price stabilization and demand expansion, with product prices largely stable since the beginning of the year. The company's Q2 single-quarter revenue reached RMB 548 million, a record high representing 42.06% year-over-year growth and a sequential return to profitability. Multiple brokerages have recently issued Buy ratings, with an institutional consensus target price of RMB 158.22.

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