ST Engineering announced after market close on Tuesday (April 29) that its wholly-owned subsidiary, ST Engineering RHQ, will issue bonds totaling 750 million (approximately S981 million). These bonds are part of the company’s S$5 billion global medium-term note program.
The bonds are expected to be issued on May 8, with an annual coupon rate of 4.25% and a maturity date of May 8, 2030. Interest will be paid annually at a fixed rate. The bonds will be issued in denominations of 200,000andmultiplesof1,000 thereafter.
ST Engineering stated that the net proceeds from the issuance will be used to refinance existing debt. The bonds are primarily targeted at institutional and qualified investors. The company will apply for listing and trading approval on the Singapore Exchange (SGX), with trading expected to commence on May 9.
As of 10:00 a.m., ST Engineering’s stock price remained unchanged at S$7.32.
免责声明:投资有风险,本文并非投资建议,以上内容不应被视为任何金融产品的购买或出售要约、建议或邀请,作者或其他用户的任何相关讨论、评论或帖子也不应被视为此类内容。本文仅供一般参考,不考虑您的个人投资目标、财务状况或需求。TTM对信息的准确性和完整性不承担任何责任或保证,投资者应自行研究并在投资前寻求专业建议。