On September 8, Taiwan Semiconductor Manufacturing rose 3.35% in regular trading, trading at $438.975 per share, with turnover of $874 million.

On the news front, ASML officially announced it has secured firm procurement commitments from both Taiwan Semiconductor Manufacturing and Samsung for its next-generation High NA EUV lithography systems, priced at up to $400 million per unit. Samsung plans to deploy the equipment for DRAM mass production starting in 2028, while Taiwan Semiconductor Manufacturing will integrate it into its most advanced logic chip process nodes beginning in 2030. Together with Intel, the three chip giants now form the full customer base for ASML's High NA EUV platform.

Separately, Taiwan Semiconductor Manufacturing and ASML announced a joint initiative to transition photomasks from 6-inch to 12-inch, targeting a pilot production line by 2031, which is expected to boost manufacturing efficiency by approximately 40%. ASML noted it plans to increase overall EUV equipment capacity by about 30% by 2027. The commitment reinforces AI-driven demand for increasingly complex transistor architectures as a key growth driver for advanced lithography adoption.

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