South Korea Semiconductor Expo Opens on the 14th, with HBM and Physical AI Chips as Key Highlights

Deep News
4小时前

The Korea Semiconductor Industry Association announced on October 12 that the 28th Korea Semiconductor Exhibition will be held from October 14 to 16, under the theme "Into the Era of Silicon Intelligence."

This year's exhibition is the largest in its history, with 300 companies participating, an increase of about 70 from last year, and 888 booths set up.

Samsung Electronics will center on the core theme of "AI System Design" to showcase high bandwidth memory (HBM) and next-generation three-dimensional (3D) memory technology.

It will also display mobile image sensors, processors, automotive chips, and foundry solutions, comprehensively demonstrating its integrated strength in memory, system semiconductors, and advanced packaging.

SK Hynix will unveil next-generation HBM4E (seventh-generation HBM) and high bandwidth flash (HBF) technology, while also exhibiting flagship products such as server, PC, and mobile DRAM, NAND flash, and solid-state drives (SSD).

Major South Korean materials, components, and equipment companies such as Jusung Engineering, SEMES, and Hanmi Semiconductor will also participate in the exhibition.

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