SK Hynix stated on its website that SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufacturing Company Chairman C.C. Wei on Wednesday, where they exchanged views on the latest development trends in next-generation artificial intelligence technology.

The two parties agreed to further expand their collaboration in areas including the research and development of next-generation High Bandwidth Memory and advanced packaging.

In the future, the two companies plan to accelerate related work to enhance their competitiveness in the customized AI memory market, aiming to meet the increasingly diverse and growing demands of global large-scale technology company clients.

Through its collaboration with Taiwan Semiconductor Manufacturing (TSM), SK Hynix will seek to bring high-performance products to the market at an opportune time.