HTSC's "25 Huatai S3" Bond to Settle Principal and Interest, Delist on March 23

Stock News

03/18

HTSC (06886) has announced the repayment of principal and interest, along with the delisting, for its 2025 short-term corporate bond (third tranche) issued to professional investors. The bond, identified as "25 Huatai S3," carries a coupon rate of 1.77% per annum. For each lot, the principal repayment amounts to RMB 1,000, with an interest payment of RMB 16.197 (tax inclusive). The settlement date for both principal and interest is set for March 23, 2026.

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The bond, identified as \"25 Huatai S3,\" carries a coupon rate of 1.77% per annum. For each lot, the principal repayment amounts to RMB 1,000, with an interest payment of RMB 16.197 (tax inclusive). The settlement date for both principal and interest is set for March 23, 2026.</p>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK0188","symbol_name":"融资融券","start_time":0,"source_url":"","article_id":"1123032166","we_media_id":"1036600163","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=1123032166","pubTimestamp":1773827898,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Stock News","introduction":"Global Stock News First-Time Broadcast","home_visible":1,"id":"1036600163","head_image":"https://community-static.tradeup.com/news/b3bf6d02ad1a6e9e7377eebbb162346a"},"summary":"HTSC (06886) has announced the repayment of principal and interest, along with the delisting, for its 2025 short-term corporate bond (third tranche) issued to professional investors. 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