ASMPT (00522) climbed more than 5%, rising 5.31% to HK$168.5 as of press time, with turnover of HK$378 million.

On the news front, the current AI infrastructure buildout is driving upward revisions to global semiconductor capital expenditure. Global IDM and wafer fab capex is projected to grow 27% year-on-year in 2026, with planned investment in advanced packaging production lines rising 25% year-on-year. In terms of equipment market size, total global semiconductor manufacturing equipment sales are expected to reach US$169.2 billion in 2026, up 26% year-on-year.

Open Source Securities noted that the company is deeply positioned to benefit from the AI infrastructure capex cycle reshaping the equipment market outlook. With strong technological positioning in core bonding equipment for HBM and CoWoS, orders and market share are expected to rise in tandem, combining both industry beta and alpha. Traditional back-end equipment and SMT businesses are also recovering simultaneously. In the second quarter of this year, the company achieved continuing operations revenue of HK$4.936 billion, up 52.1% year-on-year, and net profit attributable to shareholders of HK$418 million, up 177% year-on-year. With the rising revenue contribution from advanced packaging and the release of scale effects, the company is expected to enjoy a Davis double play in both earnings and valuation.