In a move to refine bonded supervision systems and foster the integrated development of service trade and high-end manufacturing, a new pilot initiative for offshore bonded inspection of integrated circuits and consumer electronics has been introduced.

The program's scope is clearly defined: integrated circuit inspection involves verifying and testing the electrical parameters, functional logic, physical characteristics, and reliability of newly developed or produced integrated circuit chips (including wafers) during the R&D, wafer fabrication, and final packaging stages. This process confirms that chip products meet quality and performance standards across design, manufacturing, and application phases. Consumer electronics inspection refers to testing and inspecting new consumer electronics products and their components for safety, performance metrics, compatibility, and reliability based on international, national, or industry standards. The notification also outlines the application criteria and procedures for participation in the pilot, alongside requirements for enhancing regulatory mechanisms.

An expert noted that this pilot program, focusing on high-value-added goods like integrated circuits and consumer electronics for bonded inspection outside comprehensive bonded zones, can leverage the growing advantages and capabilities China has developed in these sectors. It is also seen as a way to amplify the radiating and driving effect of China's high-end manufacturing on service trade.