On July 31, Taiwan Semiconductor Manufacturing rose 3.43% in pre-market trading, trading at $418.24/share, with turnover of $13.1011 million.

On the news front, a Sony executive confirmed that detailed discussions with Taiwan Semiconductor Manufacturing are progressing smoothly, lifting cooperation expectations. Simultaneously, earlier reports that Taiwan Semiconductor Manufacturing is developing an advanced chip packaging technology similar to Intel's EMIB continued to fuel bullish sentiment. The project, internally referred to as the EMIB-like initiative, has already been discussed with select customers. Taiwan Semiconductor Manufacturing currently dominates the AI chip packaging market with its CoWoS technology and has been expanding its packaging roadmap through glass substrate development and CoPoS pilot production lines.

This pre-market gain follows a strong session on July 30, when the stock surged 7.6% after the EMIB-like packaging news first broke. Additional tailwinds include ARK Invest accumulating over $20.1 million in Taiwan Semiconductor Manufacturing shares and the company's 1.4nm fab construction running ahead of schedule, with the first facility expected to be completed by April next year, while Samsung has delayed its 1.4nm mass production to 2029.

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