On July 6, ASE Technology rose 5.04% in regular trading, trading at $43.57/share, with turnover of $20.93 million. The stock extended gains following multiple positive catalysts surrounding the company's pricing power and industry tailwinds.

On the news front, ASE announced on July 1 another round of advanced packaging price increases, with hikes reaching over 20%, covering wafer-level chip-scale packaging and fan-out wafer-level packaging. Core US clients were all included in the pricing adjustment. Bank of America raised its valuation estimate for ASE, projecting that the server CPU-related packaging and testing market could expand from $1.9 billion to $9.6 billion, identifying advanced packaging as the highest-barrier segment in the supply chain. Nearly 20 global semiconductor companies initiated a new wave of price increases in July, reinforcing improving industry sentiment.

Additionally, ASE is aggressively expanding capacity with 15 new sites in the current year, including greenfield facilities in Asia and further US investment, with capital expenditure budgeted at $8.5 billion to support long-term AI-driven chip demand.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)