Shanghai Pudong Development Bank Co., Ltd. has announced the completion of its inaugural financial bond offering for 2026, a significant capital markets move. The bank confirmed that the issuance, which was approved by relevant regulatory authorities, has been fully subscribed and settled in the national interbank bond market.

According to the official announcement, the bonds, designated as the "Shanghai Pudong Development Bank Co., Ltd. 2026 First Financial Bonds," have been registered and custodied with the Interbank Market Clearing House Co., Ltd. The book-building process took place on September 15, 2026, with the issuance officially concluding on September 17, 2026.

The total issuance size reached RMB 30 billion, structured as three-year fixed-rate bonds carrying a coupon rate of 1.56%. The proceeds from this issuance are earmarked to support the bank's asset-liability management needs, strengthen its funding sources, and optimize the maturity structure of its liabilities.

The bank noted that these funds will be utilized in strict compliance with applicable laws and regulatory approvals, ultimately aiming to foster the steady and sustainable growth of its business operations. This issuance reflects the bank's proactive approach to capital market engagement and its commitment to maintaining a robust financial foundation.