On July 13, Circuit Fabology Microelectronics (09630.HK) rose 3.08% in regular trading, trading at HKD 383.8/share, with turnover of HKD 2.5793 million.

On the news front, the company recently disclosed during institutional research that new orders signed in Q1 exceeded RMB 800 million, with Q2 maintaining a high-growth trajectory. Backlog orders remain ample, and overall production lines continue operating at full capacity under high utilization. Additionally, the company's self-developed PLP 2000 — China's first 510mm×515mm panel-level packaging direct-write lithography system — has successfully secured orders from a key customer in the advanced packaging sector. The equipment supports a maximum processing size of 600mm×600mm and meets 2μm mass production requirements for CoPoS, FOPLP, and glass substrate packaging processes.

The company's advanced packaging equipment has been adopted by leading domestic OSAT firms including ChangDian and TongFu, with downstream customer base expected to expand further as more manufacturers ramp CoWoS-L capacity.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)