Goertek Microelectronics Inc. saw its Hong Kong IPO application, initially submitted on July 21, 2025, lapse on January 21, 2026, after the six-month validity period expired. At the time of filing, the joint sponsors for the offering were China International Capital Corporation (CICC), China Securities International Finance, CMB International, and UBS Group AG.

According to the prospectus, Goertek Microelectronics is a provider of intelligent sensing and interaction solutions, covering sensors, SiP (System-in-Package), and sensing interaction modules, with a particular focus on acoustic sensors. The company continuously works with global clients to explore market demands and finalize product definitions, delivering intelligent sensing interaction experiences for consumer electronics, automotive electronics, smart homes, industrial applications, and the healthcare sector.

The company has built UniSense, a platform that integrates full-stack technological capabilities spanning materials R&D, chip design, packaging and testing, algorithm and software development, and system design. This platform enables the company to provide high-performance intelligent sensing and interaction solutions at optimal costs, tailored to client requirements.