On July 31, Taiwan Semiconductor Manufacturing rose 3.21% overnight, trading at 415.78 USD/share, with turnover of 11.6028 million USD.

On the news front, TSMC is developing an advanced chip packaging technology similar to Intel's EMIB, internally referred to as the \"EMIB-like\" project, and has begun discussions with select customers. TSMC currently dominates the AI chip packaging market with its CoWoS technology, and this new packaging route expansion aims to further consolidate its leadership in advanced packaging. The stock had already surged 7.6% in the prior regular session on the initial report of this development.

Additionally, ARK Invest recently added over 20.1 million USD worth of TSMC shares across its ARKK, ARKQ, ARKW, and ARKX funds during a broader chip sector pullback. TSMC's 1.4nm new factory progress is also running ahead of schedule, with the first building at its Wafer Fab 25 expected to be completed by April next year, while Samsung has delayed its 1.4nm mass production to 2029, further widening TSMC's process technology lead.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)