Li Auto has announced its plan to publicly issue the first tranche of its 2026 Technology Innovation Bonds in the national interbank bond market. The issuance size is set at RMB 2 billion, with a maturity of three years.

The debt financing instrument will be issued at par value, with a subscription yield range between 1.5% and 2.1%. The issuance date is scheduled for June 16.

According to the prospectus, after deducting issuance expenses of RMB 750,000 for the first year, approximately RMB 999.25 million of the raised funds will be used to supplement the working capital of its subsidiary, Beijing Lidong Automobile Sales Co., Ltd. Of the remaining RMB 1 billion, RMB 800 million is allocated to Shanghai Li Auto Technology Co., Ltd. and RMB 200 million to Beijing Chehejia Automobile Technology Co., Ltd. These allocations are intended to support the normal operations and medium-to-long-term development of these technology-focused subsidiaries.