ASMPT (00522) rose over 4% again. As of the time of writing, the stock was up 4.37% to HK$183.9, with a turnover of HK$365 million. The company recently announced the sale of its entire equity stake in its U.S. subsidiary NEXX to Applied Materials for $120 million in cash. The transaction is expected to be completed by July 29, 2026. Industry insiders believe ASMPT is strategically streamlining its operations and accelerating its globalization. A research report from Guotou Securities International stated that AI chip foundries have substantial demand for advanced packaging. ASMPT's TCB equipment and silicon photonics equipment occupy a critical "enabler" position within the industry chain. The company's TCB equipment benefits from the evolution of AI GPUs towards SoIC/EMIB-T/CoWoS advanced packaging, while its silicon photonics (CPO) equipment stands to gain from the 800G/1.6T optical module upgrade cycle.