ASMPT (00522) rose more than 8% during early trading. At the time of writing, the stock was up 7.14%, trading at HK$108.1 with a turnover of HK$151 million. The increase follows the company's recent announcement that it has secured a new order from a major client to supply two ultra-fine pitch thermal compression bonding (TCB) systems. These tools are equipped with proprietary plasma-assisted oxide removal (AOR) technology and are designated for chip-to-wafer (C2W) applications. This achievement further strengthens ASMPT's position as a technology leader in the advanced packaging market. In a separate development, management from SMIC stated during an earnings briefing that its capital expenditure for 2025 is set at $8.1 billion, exceeding initial projections. The increase is primarily attributed to strong customer demand, changes in the external environment, and extended equipment delivery lead times. Assuming no major changes in the external environment, SMIC's guidance for 2026 indicates that revenue growth is expected to outpace the average of its comparable peers, while capital expenditure is projected to remain roughly in line with 2025 levels.