ASMPT (00522) saw its shares rise more than 5% during late trading. At the time of writing, the stock was up 4.19%, trading at HK$111.9 with a turnover of HK$208 million.

The company reported financial results showing sales revenue of HK$14.52 billion, a year-on-year increase of 9.8%. Post-tax profit reached HK$902 million, up 163.6% compared to the same period last year. A final dividend of HK$0.34 per share and a special cash dividend of HK$0.79 per share were declared.

Driven by artificial intelligence, the group's advanced packaging business achieved sales revenue of US$532 million, growing 30.2% year-on-year. The thermal compression bonding solution contributed most significantly to this growth.

A research report noted that the company's fourth-quarter 2025 revenue exceeded expectations. Order growth in 2025 is primarily attributed to thermal compression bonding equipment. The company forecasts that, benefiting from global AI development trends, the overall TCB market size could reach US$1.6 billion by 2028. ASMPT aims to capture 35–40% market share, equivalent to US$560–640 million.

Considering the application of C2S and C2W in logic chips, along with orders for HBM 12H and validation progress for HBM4 16H, TCB equipment is expected to remain the company's fastest-growing business segment.