The 2025 Apsara Conference will be held in Hangzhou from September 24 to 26, with over 2,000 guests from more than 50 countries expected to attend. This year's conference is themed "Cloud-Intelligence Integration, Carbon-Silicon Symbiosis," featuring three main forums and over 110 focused sessions. The three main forums - "Apsara Foresight," "Apsara Technology," and "Immeasurable Value" - will focus on the latest trends in AI, cloud computing, and industrial applications, while releasing core technologies and new products. The 110+ focused sessions will concentrate on AI infrastructure, application expansion, and productivity transformation.

For exhibitions, the conference features three main pavilions: AI+ Pavilion, Computing Pavilion, and Frontier Applications Pavilion, covering a total exhibition area of 40,000 square meters with over 500 companies showcasing 3,500 products. The AI+ Pavilion will display large model and intelligent agent development tools. Tongyi large models will present their "full-scale, multi-modal" open-source matrix and latest models. The ModelScope community will showcase its ecosystem of over 70,000 models and 16 million developers. Visitors can experience intelligent agent applications like Bailian and Wuying AgentBay.

The Computing Pavilion highlights full-stack capabilities from chips to platforms. The exhibition area is designed around four major scenarios: pre-training, post-training, inference, and intelligent agents. Alibaba Cloud will demonstrate ultra-large-scale clusters, distributed training, and inference acceleration capabilities, while debuting high-density AI servers supporting 144 compute nodes per cabinet and the new-generation high-performance network architecture HPN8.0.

The Frontier Applications Pavilion will showcase AI implementation practices from hundreds of companies. Siemens, SF Technology, China Eastern Airlines, MiniMax, and others will present Agent applications in power inspection, industrial sorting, and other scenarios. Automotive companies including FAW Group, BYD, Li Auto, and XPeng will display intelligent cockpit and autonomous driving achievements. The pavilion will also feature over 200 Agent applications and 300 AI terminal products, including AI glasses and AI PCs.

The on-site experience activities are equally rich. The "Embodied Intelligence Olympics" will host robot soccer, robot dog racing, and other events, with visitors able to experience AI glasses and robotic arm control. The "AI Super Exchange" provides a platform for enterprise-level AI products to showcase and pitch directly to demand-side parties. At nightfall, the Feitian Music Festival will present special "AI+Music" performances.

Notably, on September 18, Huawei's Connect conference unveiled the Ascend AI chip technology roadmap. According to the roadmap, Huawei launched the Ascend 910C in Q1 this year. Subsequently, it will introduce the new Ascend 950PR chip in Q1 2026 and the Ascend 950DT in Q4. In Q4 2027, Huawei will release the Ascend 960 chip, followed by the Ascend 970 chip in Q4 2028.

Analysts note that with Ascend chip iterations and accelerated super-node deployment, the entire domestic computing power industry chain is experiencing a once-in-a-decade opportunity. Regarding AIDCs, as large models enter the practical application stage, artificial intelligence is spawning numerous new application scenarios. The AI industry is in a period of rapid application explosion, with corresponding infrastructure construction at the same stage, leading to rapidly increasing AIDC demand.

Miao Fuyou, CTO of the Global Computing Consortium (GCC) Secretariat, stated that based on various forecasts, domestic AIDC construction will maintain annual growth rates of over 40% for the next two to three years. Subsequently, annual new construction volumes will continue to increase before gradually stabilizing, with growth rates expected to be around 10% by 2030.

Regarding optical modules, Yongying Fund noted that while European and American optical module manufacturers started earlier, they have increasingly focused on chip R&D, with CPO production capacity gradually shifting to China. Additionally, domestic optical module manufacturers have leveraged advantages such as labor costs to achieve market share breakthroughs in international competition, with performance consistently exceeding expectations.

Yongying Fund predicts that "CPO is currently in the verification and trial production stage, with 2025-2026 expected to be the critical verification and initial mass production phase, 2027-2028 entering the large-scale mass production stage, and full penetration beginning after 2029."

Furthermore, cooling has become an unavoidable challenge in data center investment planning. During the 2025 AIDC Industry Development Conference, Huawei Director and ICT BG CEO Yang Chaobin pointed out that with the rapid growth of AI computing scale and chip power, liquid-cooled data centers are becoming the inevitable choice for AIDCs.

Orient Securities predicts that considering NVIDIA's GB200/300 server liquid cooling market and ASIC chip-related liquid cooling markets in 2026, the global data center liquid cooling market is expected to reach approximately 68.8 billion yuan, with the domestic market at about 17.9 billion yuan, representing significant market potential.

Shanxi Securities stated that with the penetration of super-node full-cabinet solutions, copper connection and optical module market scales are expected to accelerate growth, with server OEM single-card value potentially increasing significantly. At the current juncture, they recommend actively focusing on IDC, copper connections, switching chips, liquid cooling, PSU, and other core domestic computing power segments.

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