HTSC (06886) has announced the completion of its bond issuance. The issuance of Huatai Securities Co., Ltd.'s 2026 Science and Technology Innovation Corporate Bonds (First Tranche), targeted at professional investors, concluded on July 15, 2026.

The final issuance scale for this tranche of bonds was RMB 1 billion, with a coupon rate set at 1.56%. The subscription multiple for the offering reached 4.20 times.