Amid the rapid global development of silicon carbide (SiC) semiconductor materials, Chinese companies have achieved mass production capabilities in 8-inch SiC substrates, with continuous technological breakthroughs and expanding applications. Meanwhile, progress in 12-inch technology lays the foundation for long-term industry growth. This article analyzes the current state, trends, and future prospects of 8-inch and 12-inch SiC substrates.

**Capacity Expansion: Clear Tiered Structure and Accelerated Growth** China's 8-inch SiC substrate industry has formed a distinct three-tier capacity structure. The first tier, led by SICC, TankeBlue, and Sanan Optoelectronics, boasts annual production exceeding 100,000 wafers, with products validated by international clients. SICC aims to expand its 8-inch capacity to 600,000 wafers/year by 2025, while TankeBlue targets 500,000–800,000 wafers/year. Sanan Optoelectronics plans to reach 48,000 wafers/year at its Chongqing joint venture with STMicroelectronics.

The second tier, including companies like SICC (subsidiary), Nansand, and JSG, has achieved small-to-medium-scale production (5,000–10,000 wafers/year). Nansand aims to boost 8-inch capacity to 500,000 wafers/year by 2025, while JSG is expanding internationally with a Malaysia facility.

The third tier, featuring firms like KeYou Semiconductor and Tiansheng Semiconductor, is in pilot production or sampling stages, with capacities below 5,000 wafers/year.

**Technological Breakthroughs: Crystal Growth and Defect Control** Chinese firms have made significant strides in crystal growth and defect reduction. SICC pioneered liquid-phase methods for macro-defect-free 8-inch substrates, achieving thicknesses over 60mm—far exceeding the industry average. TankeBlue developed low-resistivity (7–12mΩ·cm) 8-inch substrates, reducing power device resistance by 2–4%. Nansand and JingYue Semiconductor also achieved industry-leading defect densities.

**Application Expansion: Automotive, Energy, and Consumer Electronics** The automotive sector remains the primary growth driver, with SICC, TankeBlue, and Sanan securing major orders for EV power modules. Renewable energy and industrial applications are also adopting 8-inch substrates for higher efficiency. In consumer electronics, AR glasses emerge as a new growth area, with TankeBlue and Tongguang developing specialized optical-grade substrates.

**12-Inch Prospects: Early Progress Meets Challenges** At least 10 Chinese firms, including SICC and TankeBlue, have developed 12-inch SiC substrates, offering ~40% cost savings over 6-inch wafers. However, industrialization faces hurdles like uneven thermal fields and immature supply chains. Short-term adoption will focus on niche applications (e.g., advanced packaging), while 8-inch remains dominant for EVs and energy.

**Outlook** China's 8-inch SiC substrate industry is maturing, with tiered capacity and expanding applications. While 12-inch technology shows promise, its full-scale adoption hinges on overcoming technical and supply chain challenges. The industry is poised for a transition where 8-inch stabilizes the market and 12-inch drives future breakthroughs.