ASMPT Limited (0522) released its third-quarter 2025 results, highlighting sustained growth supported by AI-driven demand in its Advanced Packaging (AP) and mainstream businesses. Revenue for the three months ended 30 September 2025 reached HK$3.66 billion, representing a 7.6% increase quarter-on-quarter and a 9.5% increase year-on-year. Bookings totaled HK$3.62 billion, up 14.2% year-on-year, driven by continued uptake in Thermo-Compression Bonding (TCB) solutions and strong AI adoption.

Net loss of HK$268.6 million was reported, primarily attributed to strategic restructuring costs and inventory write-offs. Adjusted net profit stood at HK$101.9 million, and the company noted continued investment in research and development and IT infrastructure to enhance its competitive position.

TCB orders in advanced memory and logic applications contributed to growth, with new developments in High Bandwidth Memory (HBM) and leading-edge logic packages. In the Surface Mount Technology (SMT) segment, bookings were healthier than expected and benefited from demand in areas such as data centers and electric vehicles (EVs), particularly in China.

The company provided fourth-quarter 2025 revenue guidance of US$470 million to US$530 million, implying potential quarter-on-quarter and year-on-year increases at the midpoint. It also projected that its TCB total addressable market could surpass US$1 billion in 2027, driven by recent developments in AI infrastructure and ecosystem investments.

ASMPT maintains that its mainstream business remains supported by stable activity in AI-related infrastructure and continued momentum in China. The company will continue to monitor macroeconomic uncertainties and leverage its global presence to navigate potential impacts on operations.

More details, including the complete results announcement and investor presentation, are available on the company’s website.