Huaneng Power International Plans to Issue Up to RMB 2 Billion Corporate Bonds

Stock News

06/03

Huaneng Power International Inc. (HUANENG POWER) (00902) has announced its intention to issue a new tranche of corporate bonds.

The company plans to issue the second tranche of its 2026 science and technology innovation perpetual corporate bonds, targeted at professional investors, on June 5, 2026.

The total issuance size for this tranche will not exceed RMB 2 billion, with a par value of RMB 100 per bond.

The proceeds from the bond offering are intended for productive expenditures, which may include repaying interest-bearing debt, supplementing working capital, project investments, and operations, in compliance with relevant laws and regulations.

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