Hengong Precision Equipment Co.,Ltd. (301261.SZ) has announced a plan to issue convertible corporate bonds to unspecified investors, aiming to raise a total of no more than RMB 810 million (including the principal amount).

The net proceeds from the offering, after deducting issuance expenses, are earmarked for several key initiatives. These include a project for manufacturing embodied intelligent robot bodies, a pilot base for embodied intelligent robots along with a Shanghai research and development center, an expansion project for high-end equipment components, a new materials expansion project for high-end components, and supplementing working capital.