The application proof for the Hong Kong IPO submitted by Montage Technology Co., Ltd. (Montage Technology, 688008.SH) on July 11, 2025, has now lapsed after the standard six-month period, effective January 12, 2026. At the time of filing, China International Capital Corporation (CICC), Morgan Stanley, and UBS acted as its joint sponsors. According to the prospectus, the company is a globally leading fabless integrated circuit design firm, specializing in delivering innovative, reliable, and high-performance interconnect solutions for cloud computing and AI infrastructure. The company supplies interconnect chips, including memory interconnect chips and PCIe (Peripheral Component Interconnect Express)/CXL (Compute Express Link) interconnect chips, to leading industry clients, with applications spanning a wide range of end markets such as data centers, servers, and computing systems. Based on data from Frost & Sullivan, by revenue, the company ranked as the world's largest supplier of memory interconnect chips in 2024, capturing a market share of 36.8%.