Apple CEO Tim Cook announced that semiconductor packaging company Amkor Technology will assist Apple in advancing its chip packaging operations and supply chain reshoring initiatives.

During an interview, Cook outlined the semiconductor supply chain process: "In subsequent stages, wafers will be sent to Global Wafers in Texas, which will supply companies including Taiwan Semiconductor Manufacturing Company (TSM.US). TSMC will handle the wafer fabrication phase. Following that, Amkor Technology in Arizona will take on the chip packaging operations. Additionally, Applied Materials (AMAT.US) plays a crucial role in the semiconductor equipment sector. Therefore, we are working to achieve end-to-end localization of the entire semiconductor industry chain in the United States."

Earlier this month, Amkor Technology completed the pricing of $500 million in senior bonds. The bonds carry a coupon rate of 5.875% and mature in 2033.