JUNSHI BIO (01877) announced the successful completion of its first Sci-Tech Innovation Bond issuance for the 2026 fiscal year. The raised capital was received on January 26, 2026.
The total issuance amount for this first 2026 Sci-Tech Innovation Bond is RMB 1 billion, featuring a 3+2-year maturity term. The bond is scheduled to mature on January 26, 2031, with a coupon rate of 2.70%.