At the Intelligent Electric Vehicle Development High-Level Forum (2026), held from April 11th to 12th at the China National Convention Center Phase II in Beijing, the focus was on advancing the intelligent, green, integrated, and international development of new energy vehicles. Zhang Fangwen, General Manager of the Power Driver Product Line at NOVOSENSE, attended and delivered a speech.

Zhang Fangwen introduced that NOVOSENSE was founded in 2013 and reported revenue of approximately 3.37 billion yuan in 2025, ranking it among the top three domestic analog semiconductor companies by revenue scale. The company was listed on the STAR Market in 2022 and completed an IPO in Hong Kong in 2025, becoming one of the few chip companies to achieve a dual listing on both the A-share and H-share markets. He mentioned that in the smart vehicle sector, NOVOSENSE has developed a complete solution portfolio: covering the powertrain and electric drive systems on one side, and intelligent-related areas such as the smart cockpit, body control, and chassis on the other. If a vehicle's semiconductor needs were fully met by NOVOSENSE products, the value per vehicle could reach about 2,000 yuan. The company's products already cover mainstream categories in the analog chip market.

In Zhang Fangwen's view, the technological evolution of new energy vehicle powertrains, particularly motor control, is progressing in three main directions: First is the trend towards higher voltages and increased integration. The 800V high-voltage platform has become mainstream, with some automakers already adopting 1000V and even higher voltage platforms. Integration levels continue to rise, evolving from two-in-one and three-in-one configurations to five-in-one and even thirteen-in-one systems. There is also the emergence of skateboard chassis that integrate the battery, motor, and electronic controls. Second, requirements for reliability and safety are continuously increasing. With the implementation of new safety regulations, higher standards are being imposed on electronic control and powertrain systems, with particularly stringent requirements in overseas markets like Europe and the US. Concurrently, vehicle model iteration has accelerated significantly, shifting from a 3-5 year cycle in the past to a major redesign annually and minor updates every six months. Achieving agile development through platformization and modularization has become a major industry challenge. Third, system demands on chips are becoming more diverse. Within powertrain systems, analog chips are primarily categorized into four types: signal chain chips handle signal conditioning and processing; power management chips supply power to all electrical units in the vehicle; driver chips serve actuators like motors and solenoid valves; and the use of various sensors, such as current sensors, gyroscopes, and pressure sensors, is continuously growing. NOVOSENSE has achieved coverage and mass production across all these categories.

Furthermore, within motor drive systems, NOVOSENSE possesses two key, advantaged products: gate driver chips, which have captured over 50% market share domestically and are widely used in main motor controllers, OBCs, and DCDC converters; and current sensors, which represent a category with a relatively high BOM cost contribution in motor drive systems and are also a market-leading product for the company.

Looking ahead, Zhang Fangwen stated that NOVOSENSE is also integrating power device health monitoring functionality into its driver chips. This can predict the end-of-life threshold of power transistors in advance, alerting users to perform maintenance proactively to avoid roadside breakdowns, thereby further enhancing system safety. "Looking at the global development of the automotive industry, both Europe/America and Japan have achieved synergistic growth between their semiconductor and automotive sectors. We firmly believe that as the Chinese automotive industry rises rapidly on the global stage, it will inevitably drive the synchronous growth and collaborative advancement of domestic semiconductors."