HTSC to Pay Interest on "Huatai KC01" Bond on May 13

Stock News

05/08

HTSC (06886) has announced that interest payment for Huatai Securities Co., Ltd.'s 2025 public offering of science and technology innovation subordinated bonds (Phase I) to professional investors will be made on May 13, 2026. The bond is abbreviated as Huatai KC01. This series of bonds carries a coupon rate (annual interest rate) of 1.71%. With each lot having a face value of RMB 1,000, the interest payment per lot will be RMB 17.10 (tax inclusive).

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The bond is abbreviated as Huatai KC01. This series of bonds carries a coupon rate (annual interest rate) of 1.71%. 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