CSC (06066) has announced that it will issue the first tranche of its 2026 public offering of technology innovation corporate bonds targeted at professional investors from January 29 to January 30, 2026. The issuance amount for this tranche of bonds will not exceed 1.5 billion yuan (inclusive), with a maturity period of 3 years. The bonds have a face value of 100 yuan and will be issued at par value.

No less than 70% of the proceeds raised from this bond issuance are intended for investments that comply with capital market requirements, which include, but are not limited to, replacing capital contributions to funds such as Chunlin Qincang (Hangzhou) Technology Innovation Venture Capital Partnership Enterprise (Limited Partnership). The remaining portion of the funds will be used to supplement working capital.