On August 4, Taiwan Semiconductor Manufacturing rose 3.05% in pre-market trading, trading at $418.5/share, with turnover of approximately $52.23 million.

On the news front, Taiwan Semiconductor Manufacturing confirmed that its Kumamoto-based wafer fab JASM has fully resumed normal production following the July 28 magnitude 7.1 earthquake in Kumamoto that forced a precautionary shutdown for inspection and calibration. Market participants had previously flagged uncertainty over the recovery timeline, with analysts noting potential disruptions to automotive chips and image sensor delivery schedules. The company also announced a donation of 250 million yen for earthquake relief efforts.

Multiple positive fundamental catalysts are also supporting the stock. The company's 3nm capacity ramp is exceeding expectations, with its monthly target of 180,000 wafers potentially being achieved ahead of schedule. Additionally, the company is developing an EMIB-like advanced packaging technology to complement its dominant CoWoS platform, which drove an 7.6% rally on July 30 when the development was first reported.

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