Tianshui Huatian Technology Co., Ltd. (002185) announced on the evening of October 16 that the company plans to acquire 100% of the shares of Huayi Microelectronics from 27 trading parties, including Huatian Electronics Group, Xi’an Houyi Investment, and Xintian Yubl, through the issuance of shares and cash payment, along with raising supporting funds. The company's stock will resume trading beginning October 17.
Huayi Microelectronics is a key subsidiary of Huatian Group, focusing on semiconductor power devices and located in Xi'an. Its products are widely used in electric vehicles, industrial controls, automotive electronics, and other sectors, holding a significant market share in the domestic electric vehicle controller market.
Huatian Technology indicated that this transaction will allow the company to quickly enhance its packaging and testing business in the semiconductor sector, expanding its power device packaging and testing operations. This will create a comprehensive service that covers integrated circuits, discrete devices, and other subdivisions, providing customers with a wider range of packaging and testing products. Additionally, the company plans to extend the R&D, design, and sales of its proprietary power device products, encompassing automotive, industrial, and consumer-grade devices, thereby developing a second growth curve and achieving new revenue streams.
In the first half of this year, Huatian Technology reported operating revenue of 7.78 billion yuan, reflecting a year-on-year growth of 15.81%, with a net profit attributable to shareholders of 226 million yuan, which is a year-on-year increase of 1.68%. The company noted that in the first half of 2025, fueled by a general recovery in the semiconductor industry's vitality, the market demand for packaging and testing services steadily increased, alongside significant growth in orders for automotive electronics and memory devices.
According to Huatian Technology's analysis, as we move into the second half of 2025, the demand for semiconductors is expected to rise notably due to breakthroughs and widespread applications of technologies related to AI and large models, with the global semiconductor market maintaining an optimistic growth trajectory.
During institutional surveys in the first half of this year, Huatian Technology stated its commitment to continuous technological innovation and advancing packaging technology R&D, strengthening market research, focusing on specific development areas, and promoting the maturation and conversion of related platform technologies, while actively laying out CPO packaging technology, which will serve as a growth point for future development.