FIT HON TENG (06088) extended its afternoon gains by more than 16%, trading up 15.55% at HKD 6.09 as of press time, with turnover reaching HKD 439 million.

On the news front, Gilad Shainer, Senior Vice President at NVIDIA (NVDA), recently declared at a technology forum that CPO (Co-Packaged Optics) has entered mass production. Switches developed in collaboration with the supply chain have begun delivery to close partner customers, and large-scale deployment into global AI factories is expected in the second half of the year.

Kaiyuan Securities believes that the growth in cluster scale will double the demand for Scale-up interconnection bandwidth, potentially accelerating the industrial penetration of optical interconnect technologies such as NPO/CPO. This could drive a structural revaluation of the value of optical communications within AI infrastructure.

Guozheng International previously noted that FIT HON TENG has built a core competitive advantage in AI computing infrastructure through a copper-optical synergistic, system-level solution. Its three major product lines鈥攈igh-speed connectivity, high-voltage power distribution, and liquid cooling鈥攁re being deployed in coordination. At OFC 2026 and GTC 2026, the company will showcase high-barrier products such as the 102.4T ELSFP external laser module, 1.6T high-speed connectivity solutions, and the LC Busbar. With deep collaboration with ecosystem partners like Broadcom and NTT, the next-generation backplane connectors and CPO solutions are expected to ramp up volume in the second half of 2026, while 102.4T-related products will begin contributing significant revenue from 2027 onwards.