Taiwan Semiconductor Manufacturing (TSM, Financial) introduced its next-generation chip technology—dubbed A14—at its North American Technology Symposium in Santa Clara, California on Wednesday. The new process aims to improve on-device artificial intelligence capabilities and enhance overall computing power in future smartphones and AI applications.

The A14, which won't enter production until 2028, builds on TSMC's upcoming N2 process (scheduled for later this year). According to the company, A14 chips will deliver 15% faster performance, 20% higher logic density, and consume up to 30% less power compared to the N2. The A14 refers to a 14-angstrom node—equivalent to 1.4 nanometers—versus the 2-nanometer scale of N2.

Major tech firms including Apple (AAPL, Financial) Advanced Micro Devices (AMD, Financial), Intel (INTC, Financial), and Nvidia (NVDA, Financial) are all expected to use the N2 process in their future chip designs.

TSMC CEO C.C. Wei highlighted the company's roadmap in pushing forward chip innovation for AI and high-performance computing. In addition to the A14, TSMC also showcased updates in packaging, specialty chips, and 3D stacking, all aimed at powering AI in devices ranging from smartphones to self-driving cars.