博通发布200G/lane速率的第三代共封装光学CPO产品

讯石光通讯

2025/05/16

-导读-博通发布第三代200G/lane CPO产品线，并展示了第二代100G/lane CPO产品及生态系统的成熟性，OSAT工艺、散热设计、操作流程、光纤布线和整体良率实现关键改进。ICC讯5月15日，博通公司（AVGO）今日宣布，其共封装光学（CPO）技术取得重大进展，推出第三代每通道200G（200G/lane）CPO产品线。除200G/lane的突破外，博通还展示了第二代100G/...

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Acc"},"translate_title":"Broadcom releases third-generation co-packaged optical CPO product with 200G/lane rate","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AVGO":1},"content_text":"-导读-博通发布第三代200G/lane CPO产品线，并展示了第二代100G/lane CPO产品及生态系统的成熟性，OSAT工艺、散热设计、操作流程、光纤布线和整体良率实现关键改进。ICC讯5月15日，博通公司（AVGO）今日宣布，其共封装光学（CPO）技术取得重大进展，推出第三代每通道200G（200G/lane）CPO产品线。除200G/lane的突破外，博通还展示了第二代100G/lane  CPO产品及生态系统的成熟性，重点强调了OSAT工艺、散热设计、操作流程、光纤布线和整体良率的关键改进。越来越多的公开行业合作伙伴名单进一步印证了博通CPO平台的成熟度，该平台正为大规模人工智能部署提供横向扩展（scale-out）和纵向扩展（scale-up）支持。博通的CPO技术传承博通在CPO领域的领导地位始于2021年推出的第一代Tomahawk  4-Humboldt芯片组。该芯片组推动了整个CPO供应链的早期技术学习周期，远超行业步伐。这一开创性产品引入了高密度集成光引擎、边缘耦合和可拆卸光纤连接器等关键技术。基于此成功，第二代Tomahawk  5-Bailly（TH5-Bailly）芯片组成为业界首款量产CPO解决方案。在TH5-Bailly的生产过程中，博通专注于自动化测试和可扩展制造工艺，为未来代际的大规模量产奠定了基础。通过部署100G/lane  CPO产品线，博通在CPO系统设计领域积累了无可匹敌的专业经验，实现了光电组件的无缝集成，在最大化性能的同时提供了行业最低功耗的光互连方案。如今，随着第三代200G/lane  CPO产品线的发布，以及对第四代400G/lane解决方案的承诺，博通继续引领行业，提供最低功耗、最高带宽密度的光互连技术。快速发展的CPO生态系统博通在CPO领域的领导地位不仅源于其尖端交换芯片（ASIC）和光引擎技术，还得益于由无源光组件、互连及系统解决方案合作伙伴构成的完整生态系统。通过100G/lane  CPO产品线，博通已验证了其技术规模化能力，满足基于推理的人工智能（AI）的增量需求，并支持下一代AI驱动应用。“博通多年来持续完善CPO平台解决方案，第二代100G/lane产品及生态系统的成熟度便是明证，”博通光系统事业部副总裁兼总经理Near  Margalit博士表示，“凭借第三代200G/lane  CPO解决方案，我们再次为下一代AI互连技术树立标杆。我们对行业领先性能、能效和可扩展性的承诺，将助力客户应对快速演进的AI基础设施需求。”大规模部署的关键合作伙伴里程碑博通CPO技术的进步得到了生态系统中众多公开合作伙伴的支持。本周，多家主要合作方宣布了重要里程碑：康宁公司宣布与博通在先进光纤及连接器技术领域展开合作，包括为TH5-Bailly平台提供组件。台达电子宣布推出采用紧凑3RU规格的TH5-Bailly 51.2T CPO以太网交换机，支持风冷和液冷配置。富士康互连科技（FIT）发布CPO LGA插座及可插拔激光源（PLS）笼和连接器的量产版本，这些是确保高可靠、高性能系统集成的关键组件。Micas Networks宣布量产TH5-Bailly网络交换系统，与传统可插拔模块系统相比，该系统可节省超30%的整机功耗。上海雍邑光电（Twinstar Technologies）庆祝高密度CPO光纤线缆实现里程碑式批量出货，进一步推动下一代数据中心光互连的扩展。这些合作成果彰显了CPO生态系统向完整化、集成化迈进的持续进展，为下一代AI网络解决方案铺平道路。第三代CPO：开启200G/lane系统时代博通200G/lane  CPO技术专为下一代高基数纵向扩展（scale-up）和横向扩展（scale-out）网络设计，旨在实现与铜互连相当的可靠性和能效。该技术对支持超512节点的纵向扩展集群至关重要，同时可应对下一代基础模型参数规模扩大带来的带宽、功耗和延迟挑战。第三代解决方案针对纵向扩展互连优化，可解决链路抖动和运行中断等问题——这些因素可能严重影响行业实现最低单token成本的能力。博通的第三代及第四代技术路线图包括与生态伙伴紧密合作，优化CPO解决方案集成，确保其满足超大规模数据中心和AI工作负载的严苛要求。此外，博通坚持开放标准和系统级优化，这对CPO技术的持续成功与演进至关重要。合作伙伴支持声明康宁光通信高级副总裁兼总经理Mike  O’Day表示：“康宁与博通合作多年，致力于为不断扩展的AI数据中心提供高性能、高可靠的CPO连接方案。我们提供的解决方案以更低功耗和成本实现了前所未有的光速与带宽密度。康宁期待继续与博通合作推进Bailly平台部署，并共同创新下一代200G/lane  CPO系统。”台达数据网络基础设施事业部总经理王先生称：“我们很高兴推出这款尖端CPO交换机，助力数据中心实现更高效率与性能。我们的目标是通过创新方案支持下一代网络基础设施，为AI网络提供无与伦比的速度、更低能耗和可扩展性。”富士康互连科技首席技术官Joseph Wang表示：“我们正深化与博通的合作，推动200G  CPO技术创新。双方共同努力旨在交付可扩展的AI基础设施，以高性能、高能效的互连技术应对未来数据需求。”Micas Networks首席执行官Joey Gou强调：“博通通过200G/lane  CPO方案突破网络技术边界令人振奋。双方合作推出的首款量产100G/lane  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