SmartKem Inc. Partners with Manz Asia for Advanced AI Chip Packaging Solutions

Reuters

05-19

SmartKem Inc. Partners with Manz Asia for Advanced AI Chip Packaging Solutions

SmartKem Inc. has announced a new collaboration with Manz Asia, focusing on advancing computer and AI chip packaging solutions. The partnership will feature the demonstration of SmartKem's inkjet printable dielectric layers at SEMICON® SEA 2025 in Singapore. This collaboration leverages Manz Asia's high-precision inkjet printing equipment, which supports a variety of substrates, to create scalable and sustainable semiconductor packaging solutions. The partnership aims to capitalize on the growing demand for advanced packaging in the AI sector, with panel-level packaging poised to significantly enhance throughput and reduce costs. This market is projected to grow to $600 million by 2030.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. SmartKem Inc. published the original content used to generate this news brief via PR Newswire (Ref. ID: LN90290) on May 19, 2025, and is solely responsible for the information contained therein.

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{"basename":"/hans","ssrTDKData":{"titleTemplate":"%s - 老虎证券","title":"老虎证券全球投资理财平台| 一站式投资美股新股港股A股","description":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","keywords":"老虎证券,老虎证券开户,老虎券商,老虎证券官网,老虎证券app,tigertrade老虎证券,股票,炒股,新加坡股票交易平台,投资,投资理财","social":{"ogDescription":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.be62fbe1.png","ogUrl":"https://www.itiger.com/hans/news/2536858956"},"companyName":"老虎证券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"SGP","license":"TBSG","edition":"fundamental"},"__swrFallback__":{"@#url:\"https://stock-news.skytigris.cn/v3/news\",params:#id:\"2536858956\",edition:\"fundamental\",,,undefined,":{"share":"https://ttm.financial/m/news/2536858956?lang=zh_CN&edition=fundamental","thumbnail":"","is_english":true,"pubTime":"2025-05-19 19:01","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2536858956","market":"nz","top_or_hot":-1,"title":"SmartKem Inc. Partners with Manz Asia for Advanced AI Chip Packaging Solutions","media":"Reuters","content":"<html xmlns=\"http://www.w3.org/1999/xhtml\" xmlns:newsg2=\"http://iptc.org/std/nar/2006-10-01/\" xmlns:xhtml=\"http://www.w3.org/1999/xhtml\"><head><title>\n      SmartKem Inc. Partners with Manz Asia for Advanced AI Chip Packaging Solutions\n    </title></head><body><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n        SmartKem Inc. has announced a new collaboration with Manz Asia, focusing on advancing computer and AI chip packaging solutions. The partnership will feature the demonstration of SmartKem's inkjet printable dielectric layers at SEMICON® SEA 2025 in Singapore. This collaboration leverages Manz Asia's high-precision inkjet printing equipment, which supports a variety of substrates, to create scalable and sustainable semiconductor packaging solutions. The partnership aims to capitalize on the growing demand for advanced packaging in the AI sector, with panel-level packaging poised to significantly enhance throughput and reduce costs. This market is projected to grow to $600 million by 2030.\n      </p>\n</div><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<em>Disclaimer: <span>This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. SmartKem Inc. published the original content used to generate this news brief via PR Newswire (Ref. ID: LN90290) on May 19, 2025, and is solely responsible for the information contained therein.</span></em>\n</div></body></html>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>SmartKem Inc. Partners with Manz Asia for Advanced AI Chip Packaging Solutions</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nSmartKem Inc. Partners with Manz Asia for Advanced AI Chip Packaging Solutions\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1032215980\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Reuters </p>\n<p class=\"h-time\">2025-05-19 19:01</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html xmlns=\"http://www.w3.org/1999/xhtml\" xmlns:newsg2=\"http://iptc.org/std/nar/2006-10-01/\" xmlns:xhtml=\"http://www.w3.org/1999/xhtml\"><head><title>\n      SmartKem Inc. Partners with Manz Asia for Advanced AI Chip Packaging Solutions\n    </title></head><body><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n        SmartKem Inc. has announced a new collaboration with Manz Asia, focusing on advancing computer and AI chip packaging solutions. The partnership will feature the demonstration of SmartKem's inkjet printable dielectric layers at SEMICON® SEA 2025 in Singapore. This collaboration leverages Manz Asia's high-precision inkjet printing equipment, which supports a variety of substrates, to create scalable and sustainable semiconductor packaging solutions. The partnership aims to capitalize on the growing demand for advanced packaging in the AI sector, with panel-level packaging poised to significantly enhance throughput and reduce costs. This market is projected to grow to $600 million by 2030.\n      </p>\n</div><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<em>Disclaimer: <span>This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. SmartKem Inc. published the original content used to generate this news brief via PR Newswire (Ref. ID: LN90290) on May 19, 2025, and is solely responsible for the information contained therein.</span></em>\n</div></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK4141","symbol_name":"半导体产品","start_time":0,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20250519:nNDL7xl78q:1","article_id":"2536858956","we_media_id":"1032215980","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2536858956","pubTimestamp":1747652463,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Reuters","introduction":"Reuters.com brings you the latest news from around the world, covering breaking news in markets, business, politics, entertainment and technology","home_visible":1,"id":"1032215980","head_image":"https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48"},"summary":"SmartKem Inc. has announced a new collaboration with Manz Asia, focusing on advancing computer and AI chip packaging solutions. The partnership will feature the demonstration of SmartKem's inkjet printable dielectric layers at SEMICON SEA 2025 in Singapore. This collaboration leverages Manz Asia's high-precision inkjet printing equipment, which supports a variety of substrates, to create scalable and sustainable semiconductor packaging solutions. The partnership aims to capitalize on the growing demand for advanced packaging in the AI sector, with panel-level packaging poised to significantly enhance throughput and reduce costs. This market is projected to grow to $600 million by 2030.Disclaimer: This news brief was created by Public Technologies  using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Sma","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"BK4141":"半导体产品","SMTK":"SmartKem, Inc."},"translate_title":"SmartKem Inc.与Manz Asia合作开发先进的人工智能芯片封装解决方案","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"SMTK":0.9},"content_text":"SmartKem Inc. Partners with Manz Asia for Advanced AI Chip Packaging Solutions\n    \n\n        SmartKem Inc. has announced a new collaboration with Manz Asia, focusing on advancing computer and AI chip packaging solutions. The partnership will feature the demonstration of SmartKem's inkjet printable dielectric layers at SEMICON® SEA 2025 in Singapore. This collaboration leverages Manz Asia's high-precision inkjet printing equipment, which supports a variety of substrates, to create scalable and sustainable semiconductor packaging solutions. The partnership aims to capitalize on the growing demand for advanced packaging in the AI sector, with panel-level packaging poised to significantly enhance throughput and reduce costs. This market is projected to grow to $600 million by 2030.\n      \n\nDisclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. SmartKem Inc. published the original content used to generate this news brief via PR Newswire (Ref. ID: LN90290) on May 19, 2025, and is solely responsible for the information contained therein.","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":0,"code":"91000000","status":"200"}}}