A Japanese industry consortium of automakers and chipmakers has proposed a global communication standard for automotive chiplets to an international body, aiming to advance next-generation vehicle semiconductor design, Nikkei Asia reported Monday.

The group, called Advanced SoC Research for Automotive (ASRA), includes 14 companies such as Toyota Motor (TYO:7203), Honda Motor (TYO:7267), Denso (TYO: 6902), and Renesas Electronics (TYO:6723). It submitted the proposal to the Universal Chiplet Interconnect Express (UCIe) Consortium, which sets specifications for how chiplets connect.

ASRA, formed in 2023, is developing automotive systems-on-chip (SoCs) using modular components called chiplets, Nikkei noted. These chips are intended for use in mass-production Japanese vehicles starting in 2030. SoCs integrate multiple functions into a single chip, reducing the need to design separate chips for different models.

The group's proposal includes a recovery mechanism for communication errors and outlines safety performance standards, reflecting the stricter reliability demands for automotive semiconductors. Unlike chips used in phones or PCs, those in vehicles must endure high temperatures, vibrations, and other harsh conditions to ensure safety, the report said.

ASRA said it hopes to finalize the standard quickly, with semiconductor design already underway, according to the report.

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