Applied Materials Inc. has announced an expansion of its partnership with CEA-Leti to drive innovation in specialty semiconductors. Through their joint lab based in Grenoble, France, the collaboration aims to develop materials engineering solutions to enhance energy efficiency in AI data centers. Under a memorandum of understanding, the initiative focuses on leveraging their combined expertise to accelerate innovation and commercialization of next-generation specialty chips. The upgraded lab will feature state-of-the-art equipment and advanced packaging tools, fostering breakthroughs in semiconductor technologies and contributing to the chipmaking ecosystem in France.
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