SmartKem Inc. has announced a preliminary Joint Development Agreement (JDA) with Manz Asia to advance the development of next-generation dielectric ink solutions specifically designed for AI chip packaging applications. This agreement aims to enhance the ongoing collaboration between the two companies, which has already led to a successful demonstration of an advanced inkjet metalization process for chip packaging. The partnership seeks to create scalable, high-performance solutions addressing critical bottlenecks in advanced computer and AI chip packaging, with a focus on developing 12" wafer-level and large-area panel packaging solutions. The collaboration combines SmartKem's semiconductor materials expertise with Manz's precision inkjet technology to potentially revolutionize chip manufacturing by offering higher yields and reduced costs per packaged chip. However, the JDA remains preliminary and non-binding, with no assurance of a finalized definitive agreement.