Pacific Sun Packaging Inc., a subsidiary of PMGC Holdings Inc. $(ELAB)$, is set to make its debut at the 2025 ITAD Summit in Las Vegas. The company will be showcasing its high-precision, custom-engineered packaging solutions designed specifically for IT and electronics hardware. These solutions cater to data centers, ITAD firms, and OEMs, offering tailored strategies that enhance resale value and streamline integration. Known for its fast design cycles and scalable production, Pacific Sun Packaging aims to reconnect with its existing customer base and forge new partnerships within the IT lifecycle management space. The company specializes in protective packaging for delicate IT components such as CPUs, DIMMs, SSDs, HDDs, and fiber-optic modules, ensuring compliance with rigorous standards for ESD safety and supply chain durability. CEO Mike Kerzie highlights the company's commitment to supporting the circular IT economy with U.S.-made, enterprise-grade packaging solutions.