Bank of Tianjin Co., Ltd. has announced the issuance of its "2025 Sci-tech Innovation Bonds" in the National Inter-bank Bond Market. The issuance was completed on July 30, 2025, following the book building process that took place on July 28, 2025. These are five-year fixed rate bonds with a total issue size of RMB3.0 billion and a coupon rate of 1.80%. Interest on the bonds has been accruing since July 30, 2025. The proceeds from these bonds will be directed towards supporting the sci-tech innovation sector, in line with the Overall Statistical System for the "Five Priority Areas" of Finance. The bonds aim to extend sci-tech loans and invest in bonds issued by enterprises in the sci-tech innovation field.
Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Bank of Tianjin Co. Ltd. published the original content used to generate this news brief on July 30, 2025, and is solely responsible for the information contained therein.