英伟达 CEO 黄仁勋突访台积电，披露 Rubin 架构六款新芯片

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2025/08/22

英伟达 CEO 黄仁勋 8 月 22 日突然到访中国台湾地区，并在受访时透露此行主要目的是拜访台积电，感谢其在下一代芯片架构 Rubin 上的协助。黄仁勋指出，下一代 Rubin 架构已有六款全新芯片在台积电完成投片，涵盖新 CPU、GPU、NVLink 交换器、网络芯片、网络交换器以及硅光子处理器。他表示，台积电的营运团队为此付出了大量努力，自己此行专程前来表达感谢。针对外界关注的 H20 芯片...

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芯片...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202508221047149757f280&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1935042991.SGD","symbol_name":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME  \"AA\" (SGDHDG) INC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202508221047149757f280&s=b","article_id":"2561441331","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202508221047149757f280&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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对美国产业伙伴的影响。被问及此次行程是否涉及与台积电的紧急议题，黄仁勋回应称并无紧急事务需要处理，并表示台积电表现优异，自己此行仅为表达感谢。据悉，这是黄仁勋今年第三次到访中国台湾地区，此前曾于年初参加英伟达台湾分公司尾牙，5 月出席 2025 台北电脑展并发表专题演讲。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}