SK Hynix Begins Supplying High-Heat Dissipation Mobile DRAM

MT Newswires Live

2025/08/28

SK Hynix (KRX:000660) began supplying its high-heat dissipation mobile DRAM product that uses High-K Epoxy Molding Compound (EMC), the South Korean chipmaker said in a Thursday press release.

The product improves thermal conductivity by 3.5 times as compared to existing materials, and enhances vertical heat resistance by 47%, the release said.

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